Design:

l DML up to 28Gb/s for 50G PAM4 operation

l Driver integrated

l Integrated low power TEC for superior performance over temperature(-5~80℃)

l XMD package

优势：

l Driver/Laser温控，便于模块三温调试

l BOX封装，射频传输一致性好

l Driver内置，模块整体成本优势明显